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Shenzhen Chaosheng Electronic Technology Co.,Ltd
Chaosheng Group (Hong Kong) Technology Development Co., Ltd. Shenzhen Chaosheng Electronic Technology Co.,Ltd Zhejiang Kunyu Electronic Technology Co., Ltd. Shenzhen Mingze Electronic Technology Co.,
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10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

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10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

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Brand Name : China chao sheng

Model Number : PCB+SMT+DIP+PCBA production

Place of Origin : Shenzhen, Guangdong, China

MOQ : 1PCS

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 5-200K/pcs per month

Delivery Time : PCB 20 days / PCBA three days

Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box

Certification : ISO/UL/RoHS/TS

Board thickness : 1.6mm

Copper thickness : 1/2OZ 1OZ 2OZ 3OZ

Base material : FR-4

Min. line spacing : 0.1mm4mil)

Min. line width : 0.1mm(Flash Gold)/0.15mm(HASL)

Min. hole size : 0.075mm(3mil)

Surface finishing : ENIG

Product name : Printed Circuit Design PCB Assembly Electronic Board Manufacturer

Solder mask color : Blue.green.red.black.white.etc

Application : pcb printed circuit board

Solder mask : Green. Red. Blue. White. Black.Yellow

Name : Industrial Control PCBA Customize Multilayer Printed Circuit Board

Service : PCB&PCBA

Layers : 1~28

Usage : for cellphone battery

Item : Multilayer PCB Board

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10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed

Product Description

  1. 10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed Circuit Board Assembly for
  2. High Speed SMT PCB Assembly Lea,SMT PCB Service,anti-static film,Flexible Multilayer Printed Circuit Board Assembly for
  3. Industrial product series
  4. 10-layer PCB production, purchasing components, SMT+DIP+ plug-in production
  5. Packing: Pearl anti-static film / vacuum packaging / plastic box

  6. PCB, FPC process production capability

  7. One stop services:
  8. PCB layout
  9. Electronic design
  10. Engineering
  11. PCB fabrication
  12. PCB Assembly
  13. Box Build
  14. IC Programming
  15. Testing
  16. Parts sourcing
  17. Supply management
  18. After sales servies et

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

PCB capability and services:

  1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
  2. Flexible PCB (up to 10 layers)
  3. Rigid-flex PCB (up to 8 layers) CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
  4. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
  5. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
  6. Quantities range from prototype to volume production.
  7. 100% E-Test

PCB Assembly services:

  1. SMT Assembly
  2. Automatic Pick & Place
  3. Component Placement as Small as 0201
  4. Fine Pitch QEP - BGA
  5. Automatic Optical Inspection

Through-hole Assembly

  1. Wave Soldering
  2. Hand Assembly and Soldering
  3. Material Sourcing
  4. IC pre-programming / Burning on-line
  5. Function testing as requested
  6. Aging test for LED and Power boards
  7. Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
  8. Packing design

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2～45L 2～60L 2～80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1～36L 1～50L 1～60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2～12L 2～18L 2～26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3～26L 3～30L 3～50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4～45L 4～60L 4～80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42～8.0mm 0.38～10.0mm
Min.16L(mm) 0.53 1.60～8.0mm 0.45～10.0mm
Min.18L(mm) 0.63 2.0～8.0 0.51～10.0mm
Min.52L(mm) 0.8 2.50～8.0mm 0.65～10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10～254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1～40u" 1～60u" 1～120u"
Nithick 76～127u" 76～200u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth＆space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole		 PTH resin plug hole + plating fill
Electroplated hole/copper plug hole


Certificate:

IPC Standard

ISO9001

ISO/TS16949

UL

Testing and value added services:

AOI (Automatic optical inspection)

ICT(In-circuit test)

Reliability test

X-Ray Test

Analogue and digital function test

Firmware programming

Shipping Method and Payment terms:

1. By DHL, UPS, FedEx, TNT, or using clients account.

2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.

3. By sea for mass quantity according to customer's requirement.

4. By customer's Forwarder

6. T/T, West Union, etc.

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production


Product Tags:

surface mount pcb assembly

      

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